| Card Dimensions and Thickness | 12% | Whether the finished card maintains consistent size, thickness, flatness, and edge quality. | ISO/IEC 7810 ID-1 format: 85.60 mm × 53.98 mm; nominal card thickness is 0.76 mm. | Dimensional inspection records, calibrated measuring tools, and representative samples. | Visible warping, rough edges, inconsistent thickness, or unclear tolerances. |
| PVC Material and Lamination | 10% | Material composition, layer bonding, surface durability, and resistance to delamination. | The card should remain bonded after normal bending, temperature changes, and repeated handling. | Material specifications, production-control records, and test samples from the intended production line. | Bubbling, peeling, layer separation, or unexplained material substitutions. |
| Chip and Antenna Integration | 14% | Chip type, contact or contactless interface, antenna placement, read range, and encoding process. | Contact cards should follow the applicable ISO/IEC 7816 interface; contactless cards commonly use ISO/IEC 14443 requirements. | Chip traceability, interface test results, functional samples, and controlled personalization procedures. | Untraceable chips, unstable reading, inconsistent antenna performance, or unsupported chip specifications. |
| Printing and Visual Quality | 10% | Color consistency, registration accuracy, sharpness of text, barcode quality, and scratch resistance. | Color and print tolerances should be agreed in an approved production proof before mass production. | Signed color proof, inspection standards, barcode verification results, and documented defect limits. | Color drift, blurred microtext, poor registration, or missing acceptance criteria. |
| Personalization and Data Security | 14% | Data transfer, key management, access control, file handling, rejected-card destruction, and audit trails. | Security controls should be matched to the project’s data-protection requirements and applicable privacy laws. | Documented access permissions, secure file transfer, confidentiality agreement, audit logs, and destruction records. | Shared passwords, uncontrolled spreadsheets, unrestricted production-floor access, or no rejected-card procedure. |
| Quality Management | 12% | Incoming inspection, in-process controls, final inspection, corrective actions, and batch traceability. | A documented quality system with defined sampling, acceptance criteria, and nonconformity handling. | Valid quality-system certificate where applicable, inspection reports, lot numbers, and corrective-action records. | No lot traceability, informal inspections, or inability to provide batch records. |
| Testing and Compliance Documentation | 10% | Whether test reports apply to the actual card construction, chip configuration, and production process. | Relevant ISO/IEC specifications, electrical tests, material tests, and destination-market requirements should be identified. | Recent reports from competent laboratories with clear sample descriptions and test dates. | Generic certificates, expired reports, or documents referring to a different product. |
| Production Capacity and Lead Time | 8% | Actual capacity for blank cards, chip embedding, printing, personalization, packaging, and peak-season orders. | Capacity should be demonstrated for the required monthly volume rather than quoted only as theoretical maximum output. | Production schedule, capacity statement, historical on-time delivery data, and contingency plan. | Unrealistic delivery promises, dependence on undisclosed subcontractors, or no capacity plan. |
| Sampling and Pre-Production Approval | 5% | Availability of engineering samples, printed proofs, encoded samples, and pilot-run approval. | Samples should use the same materials, chip configuration, and processes planned for mass production. | Approved golden sample, signed specifications, and documented change-control process. | Sample made with different materials or refusal to provide a production-equivalent sample. |
| Total Cost and Commercial Terms | 5% | Unit price, tooling, sampling, personalization, packaging, inspection, shipping, duties, and payment terms. | Compare total landed cost and total risk, not only the quoted card price. | Itemized quotation, fixed validity period, clear warranty, and defined responsibility for defective cards. | Hidden fees, unclear warranty terms, unusually low pricing, or large unexplained cost changes. |