| Polypropylene (PP) | Good when made and cleaned for high-purity wet processing; cleanliness depends on resin, fabrication, and handling. | Good | Generally good with many aqueous acids and alkalis at moderate temperatures; compatibility can be limited by strong oxidizers and some solvents. | Lightweight, widely used, and economical for many wet-process applications. | Check temperature limits, chemical concentration, carrier loading, and particle or extractables performance over repeated cycles. |
| Polyvinylidene fluoride (PVDF) | Very good when high-purity grades and suitable fabrication practices are used. | Very good | Broad resistance to many acids and halogens; suitability varies with chemical, concentration, temperature, and exposure time. | A useful balance of chemical resistance, stiffness, and service life in demanding wet environments. | Verify compatibility with the exact bath recipe and confirm that molded or machined parts meet cleanliness requirements. |
| Perfluoroalkoxy polymer (PFA) | Excellent potential | Good | Excellent resistance to a wide range of aggressive process chemicals; verify conditions for the specific application. | High chemical inertness and low contamination potential make it suitable for stringent purity requirements. | Typically higher in material and fabrication cost; assess stiffness, design support, and handling requirements. |
| Polyether ether ketone (PEEK) | Good to very good, depending on grade, manufacturing, and cleaning validation. | Excellent | Resists many chemicals, but strong oxidizing agents and some process conditions require careful compatibility review. | High stiffness and wear resistance can support robust carrier features and repeated handling. | Confirm extractables and particle performance, as well as compatibility with every chemical and temperature in the process. |
| Fused silica / quartz | Excellent potential | High hardness, but brittle and susceptible to chipping or breakage under impact. | Resists many acids, but hydrofluoric acid and fluoride-containing chemistries attack silica-based materials. | High-purity inorganic material with good thermal stability. | Assess breakage risk, edge protection, handling method, and whether any process step uses HF or fluoride chemistry. |
| Selection priority for HJT wet processing | Specify particle, ionic contamination, and extractables requirements for the actual process. | Consider wafer support, transfer loads, clamping, and expected replacement interval. | Validate against the full chemical sequence, including concentration, temperature, dwell time, and rinsing. | Match the material to the carrier design, wafer format, and wet-bench operating conditions. | Run a process-specific compatibility and cleanliness qualification before production release. |
| Note: Ratings are general material-level comparisons, not guarantees for a particular carrier. Actual performance depends on material grade, fabrication quality, surface finish, chemical concentration, temperature, exposure time, and cleaning practice. Confirm compatibility and contamination performance with the carrier supplier and process qualification data. |