| 1 |
Computer Room Air Conditioning (CRAC/CRAH) |
Approximately 3–12 kW per rack |
Room air; chilled water or refrigerant at the cooling unit |
Nearly 100% of rack heat when airflow is properly managed |
Low at rack level; may require chilled-water infrastructure |
Conventional enterprise data centers, colocation halls and lower-density server rooms |
Established |
| 2 |
In-Row Cooling |
Approximately 5–20 kW per rack |
Conditioned air supplied directly between or beside racks |
High for contained rows; depends on rack layout and airflow containment |
Low to moderate, depending on chilled-water or DX design |
High-density retrofit projects and data halls requiring localized cooling |
Established |
| 3 |
Air-Cooled Rear Door Heat Exchanger |
Approximately 10–30 kW per rack |
Air-to-air heat exchange at the rear of the rack |
Typically 50–80% of rack heat, with residual heat handled by room cooling |
None at the rack; no liquid connection required |
Moderate-density retrofits where facility water and liquid piping are unavailable |
Commercial |
| 4 |
Chilled-Water Rear Door Heat Exchanger |
Approximately 20–50 kW per rack |
Chilled water circulated through a rear-door coil |
Typically 70–100% of rack heat, depending on coil and water conditions |
Requires a controlled water loop and leak-management provisions |
AI, HPC and high-density retrofit deployments using existing chilled-water systems |
Commercial |
| 5 |
Direct-to-Chip Cold-Plate Cooling |
Approximately 20–100+ kW per rack |
Water or engineered dielectric coolant circulated through cold plates |
Usually 70–90% of CPU/GPU heat; memory, storage and power components may remain air-cooled |
Requires a secondary coolant distribution loop and leak detection |
AI training, large-scale inference, HPC and accelerated-computing clusters |
Rapidly scaling |
| 6 |
Hybrid Air-and-Liquid Rack Cooling |
Approximately 20–80 kW per rack |
Direct liquid cooling for processors plus air cooling for remaining components |
Approximately 50–90%, based on the liquid-cooled component mix |
Moderate; requires liquid distribution while retaining air-side cooling |
Phased upgrades where existing air-cooled infrastructure must be retained |
Commercializing |
| 7 |
Single-Phase Immersion Cooling |
Approximately 20–100+ kW per tank or rack equivalent |
Non-boiling dielectric fluid |
Near 100% of immersed component heat; external heat rejection remains necessary |
Low inside the tank; may use dry coolers or facility-water heat exchangers |
High-density AI, HPC, edge installations and locations with constrained airflow capacity |
Emerging commercial |
| 8 |
Two-Phase Immersion Cooling |
Approximately 20–100+ kW per tank or rack equivalent |
Boiling dielectric fluid with vapor condensation |
Near 100% of immersed component heat |
Usually low at the tank; condenser design determines facility-water requirements |
Specialized high-density computing, research, HPC and selected AI deployments |
Emerging |
| 9 |
Coolant Distribution Unit (CDU)-Based Rack Loop |
Approximately 20–100+ kW per rack group |
Separately controlled primary and secondary liquid loops |
Supports direct-to-chip or rear-door systems; coverage depends on connected equipment |
Requires facility-side water or a dry-cooler loop, plus secondary-loop controls |
Multi-rack AI and HPC deployments needing isolation, filtration and flow control |
Commercial |
| 10 |
Modular or Prefabricated Liquid-Cooled Data Center |
Approximately 10–60+ kW per rack, project-dependent |
Integrated air, direct liquid, rear-door or immersion systems |
Configured to provide partial or near-total IT heat removal |
Project-specific; can be designed with chilled water, dry coolers or hybrid heat rejection |
Rapid deployment, edge computing, temporary capacity and remote industrial sites |
Expanding |