| Two-Part Structural Epoxy | Epoxy resin and amine or polyamide hardener supplied separately | Automotive assemblies, machinery, metal bonding, construction components, marine equipment, and general structural joining | Chemical reaction after mixing; room-temperature or accelerated heat cure | Approximately −40°C to 120°C, depending on formulation | High shear strength, strong adhesion to metals and composites, gap-filling capability, and good chemical resistance | Requires accurate mixing; limited working time; generally slower to cure than instant adhesives |
| One-Part Heat-Cure Epoxy | Pre-catalyzed epoxy formulation stabilized for storage before thermal activation | Automotive body structures, electronics, industrial equipment, transportation components, and composite manufacturing | Heat activation, commonly in ovens or heated tooling | Approximately −40°C to 150°C; some engineered grades are higher | Consistent production quality, no on-site mixing, long working life before activation, and suitability for automated processes | Requires controlled heating equipment and may be unsuitable for heat-sensitive substrates |
| Toughened Epoxy | Epoxy modified with elastomers, thermoplastics, rubber particles, or other impact-resistant phases | Vehicle crash structures, rail vehicles, wind-turbine components, aircraft interiors, and vibration-prone assemblies | One-part heat cure or two-part chemical cure | Approximately −40°C to 140°C, formulation-dependent | Improved peel resistance, impact tolerance, fatigue performance, and resistance to vibration | May have lower hardness or heat resistance than highly rigid epoxy systems |
| Flexible Epoxy | Epoxy resin modified with flexible polymers or reactive diluents | Sealing, cable components, dissimilar-material bonding, appliances, and assemblies exposed to thermal expansion | Room-temperature chemical cure or moderate-temperature heat cure | Approximately −40°C to 100°C | Better flexibility, stress relief, vibration tolerance, and adhesion across materials with different expansion rates | Usually lower modulus, hardness, and maximum temperature capability than rigid structural epoxy |
| Electrically Insulating Epoxy | Filled or unfilled epoxy formulated for dielectric insulation and environmental protection | Electronic component encapsulation, transformers, sensors, motors, circuit assemblies, and electrical terminals | Room-temperature, moisture-assisted, or heat-accelerated cure | Approximately −40°C to 150°C, depending on electrical grade | Electrical insulation, moisture resistance, mechanical protection, and improved resistance to vibration and contamination | Rework can be difficult after curing; cure shrinkage and thermal management must be considered |
| Electrically Conductive Epoxy | Epoxy matrix filled with silver, copper, nickel, or other conductive particles | Electronic packaging, component attachment, grounding, electromagnetic shielding, and sensor assembly | Room-temperature or heat-accelerated chemical cure | Approximately −55°C to 150°C, grade-dependent | Combines bonding with electrical continuity, provides localized attachment, and can reduce soldering requirements | Higher material cost, possible electrical resistance changes with temperature, and sensitivity to surface preparation |
| Thermally Conductive Epoxy | Epoxy filled with ceramic, aluminum nitride, alumina, or other thermally conductive materials | LED assemblies, power electronics, heat sinks, battery systems, sensors, and thermal interface bonding | One-part heat cure or two-part chemical cure | Approximately −40°C to 150°C | Transfers heat while maintaining mechanical attachment and, in ceramic-filled grades, electrical insulation | Higher viscosity, reduced flexibility, and potentially higher processing cost than standard epoxy |
| Epoxy Film Adhesive | Pre-formed, supported or unsupported film containing a controlled amount of epoxy resin and curing agent | Composite laminates, aircraft structures, honeycomb panels, automotive parts, and high-volume bonded assemblies | Pressure-assisted heat cure, frequently using an autoclave, press, or heated tool | Approximately −55°C to 120°C; specialized systems may be higher | Uniform bond-line thickness, low waste, clean handling, and excellent suitability for composite manufacturing | Requires accurate storage, controlled temperature, pressure, and tooling during processing |